航天器大尺寸阵列封装FPGA器件的落焊工艺.pdf

电子工艺技术
228 Electronics Process Technology 2021年7月 第42卷第4期

航天器大尺寸阵列封装FPGA器件的落焊工艺
来林芳，雷素玲，常春兰，沈丰，李晴
100190
摘　要：针对航天器电子产品上大规模阵列封装器件三防固封后落焊的特点，分析了三防漆与硅橡
FP器件落焊的影响，重点对返修工作站拆卸和焊接元器件时印制板组件的热分布情况进行了研究。结
FP器件落焊的具体工艺流程与实施方
法，验证了方法的有效性。
关键词：；落焊；阵列封装器件；返修；三防固封
中图分类号：TN605文献标识码：Ａ　文章编号：1001-3474202104-0228-04
Soldering Process of Large-size Array Packaging FPGA Devices for Spacecraft
LAI Linfang, LEI Suling, CHANG Chunlan, SHEN Feng, LI Qing
( Beijing Institute of Space Mechanics & Electricity, Beijing 100190, China )
Abstract: According to the characteristics of FPGA devices in large-size array packaging on spacecraft
electronic products, the infl uence of three-proofi ng conformal coating and silicone rubber adhesive staking
on the soldering process of FPGA devices is analyzed. It is focused on the heat distribution of the printed
circuit board assembly when the FPGA devices are removed and then soldered using the rework station