基于体硅工艺的静电致动微夹持器制作工艺分析.pdf

基于体硅工艺的静电致动微夹持器制作工艺分析.pdf第卷第期光学精密工程
11 2 Vol .11 No .2
年月
2003 4 0ptics and Precision Engi neeri ng Apr . 2003
文章编号( )
1004-924X 2003 02-0109-05
基于体硅工艺的静电致动微夹持器制作工艺分析
李勇,李玉和,李庆祥,訾艳阳
(清华大学精密仪器与机械学系,北京)
100084
摘要:介绍了一种基于体硅工艺的大尺寸、大深宽比梳状静电致动微夹持器的制作工艺。对微夹持器制作中的关键工艺
进行分析,重点分析蚀刻工艺的蚀刻时间对结构的影响,总结导致器件失效的原因,探讨了减少失效的方法。加工
I CP
过程中采用分步加工的办法控制蚀刻时间,成功的释放了宽,厚,等效长度达的悬臂梁型微夹持
6 !m 60 !m 5 470 !m
臂。研制出一种良好性能的具有形柔性结构夹持臂的梳状静电致动微夹持器。
S
关键词:体硅工艺;电感耦合等离子体;蚀刻;微夹持器
中图分类号: ; 文献标识码:
TN305 .2 TP241 A
Fabrication process analysis for electrostatically actuated
microgri pper based on silicon bul k micromachi ni ng
, , ,
LI Yong LI Yu- he LI Gi ng- xiang ZI Yan-yang
( ,
DePart ment of Precision instru ments and mechanology
, , )
Tsinghua unioersity BeiJing 100084 China
:
Abstract The f abrication process of b- drive electrostatically actuated microgri pper based on silicon
,
bulk micromachi ni ng is descri bed i n detail Wit h t he effect of I CP etch ti me on structure analysed . Some
,
f actors causi ng microgri pper f ailure i dentified and advices provi ded f or avoi dance of f ailure . Wit h a frac-
tional I CP etch met hod used to control t he etch ti me a gri pper fi nger of 6 !m Wi de and 5 470 !m high Was
essf ully released . A high aspect ratio microgri pper Wit h S-shaped flexi ble fi ngers has been developed .
: ; ( );
Key words silicon bulk micromachi ni ng I CP