重庆大学硕士论文 ABSTRACT Abstract The heat dissipation and cooling in the running integrate niicro—electronic parts is an important research theme of micro— higher the processing speed puter,the more heat generating from CPU the heat can’t be dissipatied effectively,the processing stability and speed will be decreased order to fit the demand for future high speed CPU chip whose running heat flux reaches to 100—1000W/cm2,the development of au efficient cooling technology has e the update key projects all over the its intensive heat transfer characteristics,heat pipe behaves a profound advantage in the cooling of integrated the basis ofthe manufactured new aluminium heat pipe sets and research work done in the Refrigeration Lab of Chongqing University,a nEW thermal syphon cooling machine made of aluminium has been text is to study this kind of thermal syphon to use working fluid Methanol,Ethanol and Acetone. With experiments and theoretical find When the heat discharge iS smaller than the entrainment jnfluences the ability of of work quality is the quantity of injection and dry limit fluid inventory,the optimum quantity of injection of the three working fluid is 8-149;And the delivering factor that transmission toefficient iS determined by capillary the heat transmission ability of the thermal ,among the three working fluid,Acetone is the wind—speed has the obvious fu。nction in heat transmission of the thermal when the wind—speed es above l m/s hereafter,wind—speed increase for the CPU thermal siphon of transmit heat the ability’S gain result the it is considered perfect when the wind—speed is lrn/ this experimentation we found that when the CPU thermal syphon cooling machine used Acetone as working fluid,wind-speed lm/s,CPU chip caloricty 60w,its volumetric heat release rate cam