工艺流程
Production process
双面板多层板
Double-sided Mulitlayer
开料内层开料
Sheets Cutting I/L cutting
钻孔干/湿膜内层线路
Dirlling I/L Dry/Wet film
去毛剌内层曝光/显影
De-Derurr I/L Exposure/Develop
化学沉铜内层蚀刻
I/L Etching
整板电镀去膜
Panel plating Stripping
干膜线路线路检测
Dry film Trace check/AOI
曝光/显影冲定位孔
Exposal/Develop Target hole punching
蚀刻(表面处理) 黑氧化处理
Etching (Surface process) I/L Black oxide
去膜成型定位、叠层、压合
Stripping Profile Lamination
中检/测试 V-割钻靶孔
Midd check/test V-CUT Target hole drilling
阻焊印刷最终清洗钻孔
Solder resist Final clean Drilling
预烤电测去毛剌
Precure E-Test De-Derurr
曝光/显影除胶渣
Exposure/Develop (O S P) Desmear
文字印刷
Silkscreen FQC/FQA
终烤包装/出货
Postcure Packing/Shipping
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