基于H94-25C型光刻机的铝光刻工艺研究
摘要
光刻技术是指集成电路制造中利用光学-化学反应原理和化学、物理刻蚀方法,将电路图形传递到单晶表面或介质层上,形成有效图形窗口或功能图形工艺技术。
目前,随着半导体市场的增长速度不断加快,而且半导体产业对现代经济、国防和社会也产生了巨大的影响,集成电路产业之所以能飞速发展,光刻技术的支持起到了极为关键的作用。因为它直接决定了单个器件所能达到的最小物理尺寸。
本论文开始介绍了光刻工艺中所用到的设备和实验相关的材料说明。然后具体叙述了整个光刻工艺的流程和具体实验步骤,包括:表面处理,涂胶,前烘,对准和曝光,后烘,显影,坚膜,检查。以及最后光刻完成后的淀积工艺。本次实验通过实验结果分析对比不同曝光时间下的图形效果,不同显影时间下的图形效果,分析解决光刻工艺中所遇到的问题。
最后整理实验数据,对所遇到的异常情况进行分析,调整工艺菜单的参数,最终得到完整的工艺流程参数,改进优化工艺步骤。
关键词:光刻技术,光刻机,光刻胶
Study on Aluminum Lithography Process Using H94-25C Mask Aligner
Abstract
Optical lithography technology refers to during the integrated circuit manufacturing’s process, to use the principle of optics and chemical reaction, chemical and physical etching method to deliver the circuit graph to the surface of single crystal or medium layer, then form valid graphics window or functional graphics technology.
Nowadays, with the continuous increasing growth of the semiconductor market, moreover the semiconductor industry has huge influence on modern economy, national defense and society. The reason why integrated circuit industry could develop rapidly is that the support of the lithography technology has played a very important role. Because it determines the individual device could achieve the minimum physical size directly.
At the beginning my paper introduced the equipment and related materials’ introduction that would use in lithography process. And then described specifically circle of lithography process are and particular experimental steps, which include: surface treatment, coating, drying, before alignment and exposure, after drying, enhancement, hardener, check, and the last technic of after photolithograph’pletion. Through many experiments, comparing the experimental results under different exposure time and different developing time of graphical effects. analyze and solve some of the problems encountered in optical lithography.
At last, sort out experimental data, to analysis abnormal situation, and to adjust parameter
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