02集成电路工艺及版图设计(参考).ppt

集成电路工艺和版图设计概述Jian FangIC Design Center, UESTC
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Jian Fang
微电子制造工艺
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Jian Fang
IC常用术语
园片:硅片
芯片(Chip, Die):
6、8 :硅(园)片直径:1 =
6150mm; 8200mm; 12300mm;
亚微米<1m的设计规范
深亚微米<= m的设计规范
m 、 m -设计规范(最小特征尺寸)
布线层数:金属(掺杂多晶硅)连线的层数。
集成度:每个芯片上集成的晶体管数
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Jian Fang
IC工艺常用术语
净化级别:Class 1, Class 10, Class 10,000
每立方米空气中含灰尘的个数
去离子水
氧化
扩散
注入
光刻
…………….
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Jian Fang
生产工厂简介
PSI
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Jian Fang
Fab Two pleted January 2, 1996 and is a "State of the Art" facility. This 2,200 square foot facility was constructed using all the latest materials and technologies. In this set of cleanrooms we change the air 390 times per hour, if you do the math with ULPA filtration this is a Class One facility. We have had it tested and it does meet Class One parameters (without any people working in it). Since we are not making microprocessors here and we don't want to wear "space suits", we run it as a class 10 fab. Even though it consistently runs well below Class Ten.
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Jian Fang
Here in the Fab Two Photolithography area we see one of our 200mm .35 micron I-Line Steppers. this stepper can image and align both 6 & 8 inch wafers.
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Jian Fang
Another view of one of the Fab Two Photolithography areas.
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Jian Fang
Here we see a technician loading 300mm wafers into the SemiTool. The wafers are in a 13 wafer Teflon cassette co-designed by Process Specialties and SemiTool in 1995. Again these are the world's first 300mm wet process cassettes (that can be spin rinse dried).
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Jian Fang
As we look in this window we see the World's First true 300mm production furnace. Our development and design of this tool began in 1992, it was installed in December of 1995 and became fully operational in January of 1996.
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Jian Fang