PCBA半成品检验规范.pdf

文件编号��Q110-30002
昊阳天宇科技(深圳)有限公司发行日期����. ��
修订日期:
Joy Technology (Shenzhen) Corporation 02
页��次��第11之1页

半成品检验规范
WI
Semi-finished goods inspection criterion.
文件变更记录
项次日期变更内容简述版本
1 增加英文释义 02
文件编号��Q110-30002
昊阳天宇科技(深圳)有限公司发行日期����. ��
修订日期:
Joy Technology (Shenzhen) Corporation 02
页��次��第11之2页

半成品检验规范
WI
Semi-finished goods inspection criterion.
目的:为建立半成品检验与制程稽核标准,以供检验判定良品与不
良品。
Purpose: To establish semi-finished goods inspection and
process audit standard for judging the qualified product and
unqualified products .
适用范围:所有制程稽核均适用。
Scope: All process auditing .
权责:品保单位:负责所有产品检验与制程稽核及本规范之修订。
Responsibility : QA Dept. : Product inspection and process
auditing and the revision of this criterion.
作业内容
Action content:
各项检验及稽核重点及稽核如下述。
Each inspection and audit point, the auditing as below:
附件
Attachment
附件一无铅焊点与有铅焊点的对照
parison of L/F weld and lead weld.
文件编号��Q110-30002
昊阳天宇科技(深圳)有限公司发行日期����. ��
修订日期:
Joy Technology (Shenzhen) Corporation 02
页��次��第11之3页

半成品检验规范
WI
Semi-finished goods inspection criterion.
分类
条件/备注
项目判定标准说明 Classifica
Condition/R
ltem Characteristic tion
emark
Maj. Min
PTH / TU
1 极性反 零件极性标记与 PCB 极性标记相异者 V 目视 Visual
Parts Part reversed mark which is different with PCB
1
reversed polarity mark.
2 缺件 PCB 焊垫上应有零件而未焊零件者 V "
Missing
2 PCB weld pad have a part which is not be welded.
parts
3 错件 PCB 焊垫之零件与 BOM 料号不同者 V "
The part of PCB weld pad which is different with
3 Wrong parts
BOM P/N.
4 多件 PCB 焊垫上不需有零件而焊零件者 V "
PCB weld pad is no need the part which was
4 Excess part
welded.
零件本体露出底材者 V "
The material which is exposed the inside material.
零件脚有裂痕,破洞者 V "
The part pin was cracked and bursted .
零件本体表面损伤者 V "
5 Damage part