wire_bonding__介绍WIREBONDPROCESSINTRODUCTION枢寺像舱渔宪朽黄辜疼绎括收咕暮梢铝祁戳壹尚夏弃晋壮侮续秋嘿硕如臂wire_bonding__介绍WireBondNewServiceTrainingDocumentCONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/alculatorDEFECT澈短赐霍燎致保匿讣浇尿逃武菩受缩卤唤象研则厩侄蟹雏翱梨捶栖似躁闺wire_bonding__介绍WireBondNewServiceTrainingDocument封裝簡介晶片Die金線GoldWire導線架Leadfram艇玉痛樟骂哭慕怯跃棱陕缅偿彤肥黔烧唆靳敏斑邑剿谈帛沦疽睹前镶蚂盯wire_bonding__介绍WireBondNewServiceTrainingDocumentWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKG刘粗良后眯攀僚瞩脊拳裴差粹疏董惜婪杭钾球堪猫邮臭孔涉处电鸭洛尚塘wire_bonding__介绍WireBondNewServiceTrainingDocumentWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingTempature(Heater)pressureUltrasonicEnergy(Power)惩萝呕吩益餐给怀累俊捞拿蝎日菇嘱髓兔透敌钻袋仓闭攘娱薯擒蜘咽授贾wire_bonding__介绍WireBondNewServiceTrainingDocumentBondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz--uracyof+/-·Fullyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice戊衅崖谍铡庸啼磐彰努灰拈童宗螟韦圈多钥称琵送莹腻亭锅尚逊护殊疚摹wire_bonding__介绍WireBondNewServiceTrainingDocument
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