Process flow chartsPrepared by: LiamPre-BakingInner Layer PatterningAOILamination4 layer2 layerAOIPatterningCopper platingDrillingSurfaceTreatmentPackageOQCE-TestRoutingS/M Printing & PatterningShipmentPCB Process Layer:Photo-Resist LaminationDemonstration(4L Laminate) Layer : ExposureUV Exposure Photo Layer : DevelopingDemonstration(4L Laminate)4. Inner Layer : Etching5. Inner Layer : StrippingDemonstration(4L Laminate)6. PP/Copper Foil Stack up7. LaminateDemonstration(4L Laminate) ResinCopper FoilDemonstration(2L) -Resist LaminationDemonstration(2L) Exposure Photo (2L)(2L)
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