常用半导体中英对照表.docx

常用半导体中英对照表离子注入机 ionimplanterLSS理论 LindhandScharffandSchiotttheory,又称“林汉德-斯卡夫-斯高特理论”。沟道效应 channelingeffect射程分布 rangedistribution深度分布 depthdistribution投影射程 projectedrange阻止距离 stoppingdistance阻止本领 stoppingpower标准阻止截面 standardstoppingcrosssection退火 annealing激活能 activationenergy等温退火 isothermalannealing激光退火 laserannealing应力感生缺陷 stress-induceddefect择优取向 preferredorientation制版工艺 mask-makingtechnology图形畸变 patterndistortion初缩 firstminification精缩 finalminification母版 mastermask铬版 chromiumplate干版 dryplate乳胶版 emulsionplate透明版 see-throughplate高分辨率版 highresolutionplate,HRP超微粒干版 plateforultra-microminiaturization掩模 mask掩模对准 maskalignment对准精度 alignmentprecision光刻胶 photoresist,又称“光致抗蚀剂”。负性光刻胶 negativephotoresist正性光刻胶 positivephotoresist无机光刻胶 anicresist多层光刻胶 multilevelresist电子束光刻胶 electronbeamresistX射线光刻胶 X-rayresist刷洗 scrubbing甩胶 spinning涂胶 photoresistcoating后烘 postbaking光刻 photolithographyX射线光刻 X-raylithography电子束光刻 electronbeamlithography离子束光刻 ionbeamlithography深紫外光刻 deep-UVlithography光刻机 maskaligner投影光刻机 projectionmaskaligner曝光 exposure接触式曝光法 contactexposuremethod接近式曝光法 proximityexposuremethod光学投影曝光法 opticalprojectionexposuremethod电子束曝光系统 electronbeamexposuresystem分步重复系统 step-and-repeatsystem显影 development线宽 linewidth去胶 strippingofphotoresist氧化去胶 removingofphotoresistbyoxidation等离子[体]去胶 removingofphotoresistbyplasma刻蚀 etching干法刻蚀 dryetching反应离子刻蚀 ching, RIE各向同性刻蚀 isotropicetching各向异性刻蚀 anisotropicetching反应溅射刻蚀 reactivesputteretching离子铣 ionbeammilling,又称“离子磨削”。等离子[体]刻蚀 plasmaetching钻蚀 undercutting剥离技术 lift-offtechnology,又称“浮脱工艺”。终点监测 endpointmonitoring金属化 metallization互连 interconnection多层金属化 multilevelmetallization电迁徙 electromigration回流 reflow磷硅玻璃 phosphorosilicateglass硼磷硅玻璃 boron-phosphorosilicateglass钝化工艺 passivationtechnology多层介质钝化 multilayerdielectricpassivation划片 scribing电子束切片 electronbeamslicing烧结 sintering印压 indentation热压焊 pressionbonding热超声焊 thermosonicbonding冷焊 coldwelding点焊 spotwelding球焊 ballbonding楔焊 wedgebonding内引线焊接 innerleadbonding外引线焊接 outerleadbonding梁式引线 beamlead装架工