PCB中英文对照.doc

PCB线路板工艺流程及中英文对照(2009/04/0813:56)目录:公司动态浏览字体:大中小流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油)--镀金--喷锡--成型--开短路测试--终检--(CutLamination)a-1裁板(SheetsCutting)a-2原物料发料(Panel)(ShearmaterialtoSize)(Drilling)b-1内钻(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射钻孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)(PhotoProcess(D/F))c-1前处理(Pretreatment)c-2压膜(DryFilmLamination)c-3曝光(Exposure)c-4显影(Developing)c-5蚀铜(Etching)c-6去膜(Stripping)c-7初检(Touch-up)c-8化学前处理,化学研磨(ChemicalMilling)c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)c-10显影(Developing)c-11去膜(Stripping)Developing,Etching&Stripping(DES)-1黑化(BlackOxideTreatment)d-2微蚀(Microetching)d-3铆钉组合(eyelet)d-4叠板(Layup)d-5压合(Lamination)d-6后处理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8铣靶(spotface)d-9去溢胶(resinflushremoval)(CopperReduction)e-1薄化铜(CopperReduction)(HorizontalElectrolyticPlating)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)f-3低于1mil(Lessthan1milThickness)f-4高于1mil(Morethan1milThickness)f-5砂带研磨(BeltSanding)f-6剥锡铅(Tin-LeadStripping)f-7微切片(Microsection)(PlugHole)g-1印刷(InkPrint)g-2预烤(Precure)g-3表面刷磨(Scrub)g-4后烘烤(Postcure)(绿漆/绿油):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3静电喷涂(SprayCoating)h-4前处理(Pretreatment)h-5预烤(Precure)h-6曝光(Exposure)h-7显影(Develop)h-8后烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11喷砂(Pumice)(WetBlasting)h-12印可剥离防焊(PeelableSolderMask)-1金手指镀镍金(GoldFinger)i-2电镀软金(SoftNi/AuPlating)i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)(HotAirSolderLeveling)j-1水平喷锡(HorizontalHotAirSolderLeveling)j-2垂直喷锡(VerticalHotAirSolderLeveling)j-3超级焊锡(SuperSolder)j-(SolderBump)(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(Dedicated