半导体制造专业英语术语.doc

A1st level packaging 第一级封装2ndlevelpackaging 第二级封装aberration 象差/色差absorption eleration column eptor umulatev、积聚,堆积acid 酸acousticstreaming 声学流active region 有源区activate 激活activateddopant 激活杂质active ponent有源器件adsorption吸附aerosol悬浮颗粒airionizer 空气电离化器alignmentmark对准标记alignment 对准alloy 合金alternateadj、交替得,轮流得, 预备得 v、交替, 轮流,改变aluminum铝aluminum subtractiveprocess铝刻蚀工艺ambient 环境ammonia(NH3) 氨气ammoniumfluoride(NH4F) ***化氨ammonium hydroxide(NH4OH) 氢氧化氨amorphous非晶得,无定型analog模拟信号angstrom 埃anion阴离子anisotropicetchprofile 各向异性刻蚀剖面anneal退火antimony(sb)锑antirelective coating(ARC) 抗反射涂层APCVD 常压化学气向淀积applicationspecificIC(ASIC) 专用集成电路aqueoussolution水溶液areaarray面阵列argon(Ar) n、[化]氩arsenic(As)***arsine(AsH3) ***化氢,***烷ashing灰化,去胶aspectratio深宽比,高宽比aspectratiodependent etching(ARDE)与刻蚀相关得深宽比asphyxiant 窒息剂assaynumber检定数atmospheric adj、大气得atmospheric pressure大气压atmosphericpressure CVD(APCVD)常压化学气向淀积atomicforcemicroscopy(AFM) umber 原子序数attemptn、努力, 尝试,企图 vt、尝试, 企图augerelectronspectroscopy(AES)俄歇电子能谱仪autodoping 自掺杂automatic defectclassification(ADC)缺陷自动分类Bback-endofline(BEOL) (生产线)后端工序backgrind减薄backing film背膜baffle vt、困惑, 阻碍,为难(挡片)baffleassembly n、集合, 装配,集会,集结,汇编(挡片块)ballgridarray(BGA) 球栅阵列ballroomlayout 舞厅式布局,超净间得布局barrelreactor圆桶型反应室barriermetal 阻挡层金属barriervoltage势垒电压base基极,基区batch批bayandchaselayout生产区与技术夹层区beam blow-up离子束膨胀beamcurrent束流beam deceleration 束流减速beamenergy离子束能量beol (生产线)后端工序bestfocus最佳聚焦BGA球栅阵列Biasing 电压拉偏BICMOS 双极CMOSbincode number 分类代码号binmap 分类图bipolarjunctiontransistor(BJT)双极晶体管bipolartechnology 双极技术(工艺)bird’sbeak effect鸟嘴效应blanket deposition 均厚淀积blower增压泵boat舟BOE氧化层刻蚀缓冲剂Bonvoyage[法]再见, 一路顺风[平安]bondingpads 压点bonding wire 焊线,引线boron(B) 硼borontrichloride(BCL3) 三***化硼boron trifluoride(BF3) 三***化硼borophosphosilicateglass(BPSG) 硼磷硅玻璃borosilicateglass(BSG) 硼硅玻璃bottomantireflectivecoating(BARC) 下减反射涂层boule 单晶锭bracket n、墙上凸出得托架,括弧,支架v、括在一起breakthroughstep突破步骤,起始得干法刻蚀步骤brightfielddetection 亮场检查brushscrubbing 涮洗bubbler 带鼓泡槽bufferedoxideetch(BOE) 氧化层腐蚀缓冲液bulkchemical distribution 批量化学材料配送bulk gases