各种IC封装形式图片BGABallGridArrayEBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格QFPQuadFlatPackageTQFP100L详细规格SBGASC-705L详细规格SDIPSIPSingleInlinePackageSOSmallOutlinePackage -详细规格PQFPPSDIPTO8TO92TO93TO99TSOPThinSmallOutlinePackageLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageSOT143SOT220SOT223TSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray ZIPZig-ZagInlinePackageBQFP132TEPBGA288LTEPBGA288LSOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523详细规格C-BendLead aseLAMINATECSP112LChipScalePackage<spanstyle='font-size:;font-family:宋体;mso-ascii-font-family:Ta
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