基于触摸式按键的温控器设计下位机单元设计.doc

毕业设计( 论文) 题目:基于触摸式按键的温控器设计——下位机单元设计学生姓名楼建灵学号 200420090309 分院信息工程分院专业班级电子 403 班指导教师杜树旺 2008 年5月杭州中文摘要Ⅰ摘要本课题核心微处理器主要采用 MSP430F2274 单片机,外围电路主要包括:温度采集模块,湿度采集模块,触摸式按键模块及液晶显示控制模块。湿度模块和温度模块将环境湿度与温度转换成模拟信号, CPU 通过 A/D 将模拟信号转换为数字信号, 读出湿度与温度值; CPU 再通过液晶驱动器 HT1621 将湿度与温度值在液晶中显示。人机接口设立四个触摸按键分别为:调时,加,减,设置;触摸式按键主要采用电容式传感器; CPU 通过测量电容式传感器充放电时间读出键值, CPU 再对相应的键值做出响应。关键词: MSP430F2274 ; HT1621 ;触摸按键;温度采集模块;湿度采集模块英文摘要 3 Abstract This topic core microprocessor mainly uses the MSP430F2274 monolithic integrated circuit, the peripheral circuit mainly includes: Temperature gathering module, humidity gathering module, touching type pressed key module and liquid crystal display control module. The humidity module and the temperature module will transform the ambient humidity and the temperature the simulated signal, CPU the simulated signal will transform through A/D into the digital signal, the read-out humidity and the temperature value; CPU again demonstrated through liquid crystal driver HT1621 the humidity and the temperature value in the liquid crystal. The man-machine connection sets up four touching pressed keys respectively is: The timing, Canada, reduces, establishment; The touching type pressed key mainly uses the electric capacity type sensor; CPU through the survey electric capacity type sensor charging and discharging time read-out key value, CPU makes the response again to the corresponding key value. key W ord s: MSP430F2274 ; HT1621 ; Touches the pressed key ; Temperature gathering module ; Humidity gathering module 目录 III 目录 1 引言··································································································· 1 MSP430 单片微处理器········································································· 1 触摸式按键技术················································································ 1 基于摸式按键的温控器······································································· 2 什么是温控器·································································