软硬结合板和设计制作与品质要求.ppt

刚挠印刷板的设计、制作及品质要求
Rigid-Flex PCB
Design Manufacturing Quality Requirement
TT-TM-090301A
Prepared by FPC Deng Li laura ba
2009/3
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目录
为何会有软硬结合板
软硬结合板的用途
软硬结合板的常见结构
·软硬结合板的材料
·软硬结合板的设计要点
·常见结构的软硬结合板工艺流程
·制作流程中要求、问题及对策
·软硬结合板成品板的品质及测试要求
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3为何会有软板、软硬结合板
柔性线路板轻便,小巧,可弯曲性
刚挠结合的出现提供了电子组件之间一种崭新的连接方式;
刚挠电路可以在二维设计和制作线路,三维的互连组装,
Fex for
ground and high speed signals
刚挠结合板可以替代连接器,大大减少连接点。
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二·为何会有软板、软硬结合板
重复弯曲百万次仍能保持电性能
可以实现最薄的绝缘载板的阻抗控制,极端情况下,能够制作出包括绝缘
层厚度不足1m的挠性区,因此降低了重量,减少安装时间和成本:
材料的耐热性高
Engine controls汽车引擎控制
Chip scale Packages芯片的封装
减少连接器的数量,可以大大节约成本
CD(Hot bar,ACF.
Batteries
Telecommunication (replace of coaxial-cable.
更佳的热扩散能力
平面导体比圆形导线有更大的面积体积比率,有利于导体中热的扩散
Base material
Plated through holes Top layer circuits
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软板的用途
Telecom, Medical Automotive
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3软板的用途
Application-手机滑盖连接
i Layer: 2 Layers
Line width/spacing:
Surface finish ENiG
Application: Dynamic bending(100,000 cycles
Structure: Silver film on top and bottom side
Conductive Psa on the top bottom side
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软板的用途
Application- Mobile Phone Hinge(手机旋转铰链)
Layer Count:
Min pth hole
Min Line W/S

Board thickness:
EMI Shielding
Single side FCCL
Ga
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软板的用途
Application- Medical Hearing Aid医疗助听器
4L Flex with HDI and Cu Filling for Blind via
Top Sid
Bottom side
02
soldermask
um +20um plating
H Adhesive Pyralux LF D100
DS FCC
Adhesive
SS FCCL
x404
opper fum +20um plating :
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3软板的用途
Sample Project: Mobile sIM Card -Dimple
m
■■關■關■
>2 layer FPC
>Immersion Gold
Black flexible solder mask
Bottom side
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软硬结合板的用途
Application -MP4 iPod Nano
Structure(1+1+2F+1+1)HDI
6 layered rigid-Flex
Double-sided flex inner layer core
un solder mask
o tlow prep
212m
mmmmmmm
Copper
Na llow prep
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