软硬结合板设计制作指引与流程控制要点解析.ppt

软硬结合板设计制作指引与
生产控制要点
且录
软硬结合板的常见结构及工艺流程
软硬结合板的设计指引
软硬结合板的生产控制要点
常见结构及工艺流程(4L)
·1R+2F+1R:单面硬板夹软板结构
4L R-F Stack-up
cutting-Mech. drill -Shadow-Button image --Button Plating-V/L D/F-I/L exposure-DES
.- Sticking Cover lay-Pressing cover lay-Measuring expansion Coefficient -PE
FOC
NF PP Open- Plasma- -Pressing (L1&L4 is Single copper core)-Mech Drill -De-burr
L1-L4 De-smear- PTH+ Flash- Panel Plating- OL D/F- OL exposure-- AOI- S/M-C/M
ENIG- Pre- Routing- Laser De-cap-Laser Routing- Routing-ET- Pressing stiffener-FQC
常见结构及工艺流程(6L)
·2R+2F+2R:双面硬板夹软板结构
tock-up
3-4 Board cutting -I/L D/F-lL exposure-DES-AOl-BO -Sticking Cover lay
Pressing cover lay -Measuring expansion Coefficient -PE Punch--FQC
L12/L56 Board cutting-I/L D/F-DES- PE Punch--AOI-B/O
NF PP Open-Plasma-BO.-Pressing(L12&&L34&L56)-Mech Drill -De-burr
C/M-ENIG-Pre-Routing-Laser De-cap- Laser Routing-Routing-ET-Pressing
De-smear- PTH+ Flash -OL D/F- OL exposure-Pattern plate-SES- AOl- S/M
stiffener- FQC-Packing
常见结构及工艺流程(1+HD|6L)
·1+1R+2F+1R+1:1+HD|结构的硬板夹软板结构
L3-L4 Board cutting -/L D/F-ILexposure-DES
AO1- -Sticking Cover lay-Pressing
cover lay -Measuring expansion Coefficient -PE Punch--FQC
L2L5 Board cutting-I/L D/F-DEs(蚀刻单面)一 PE Punch-AO|BO(core厚大于02mm
需要在B/O前做预激光切割)
NF PP Open-Plasma -BO.-Pressing(L2&&L34&L5)-Mech Drill-De-burr- De-smear
PTH+ Flash -Panel plate--IL D/F-DES-AOl-B/O
Pressi
aser Drill-Mech. Drill --De-smear- PTH+ Flash-ODF-Pattern
L1
C/M-ENIG-Pre-Routing- Laser De-cap-Laser Routing
Routing-ET-Pressing stiffener- FQC- Packing
常见结构及工艺流程(2+HD|6L)
1+1F+2F+1F+1:2+HD|结构
Board cutting -Mech. Drilk-Shadow-- Button Image- Button plate--V/L D/F-V/L
L3-L4 exposure-DES-AOI-B O -Sticking Cover lay Pressing cover lay -ENIG-
Punch Finger--Measuring expansion Coefficient -PE Punch--FQC
2/L5 Board cutting(Single side FCCL Preparation)
L25 NF PP Open-Plasma-BO.-Pressing(L2&&L34&L5)-Laser Drill-De-smear
PTH+ Flash -Panel Plate-IL D/F-DES -UV