IPC-7530-2001 波峰焊回流焊接工艺温度曲线指南.pdf

ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES ®
IPC-7530
Guidelines for Temperature
Profiling for Mass Soldering
Processes (Reflow & Wave)
IPC-7530
May 2001 A guide developed by IPC
2215 Sanders Road, Northbrook, IL 60062-6135
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The Principles of In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of
Standardization Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should: Standards Should Not:
• Show relationship to Design for Manufacturability • Inhibit innovation
(DFM) and Design for the Environment (DFE) • Increase time-to-market
• Minimize time to market • Keep people out
• Contain simple (simplified) language • Increase cycle time
• Just include spec information • Tell you how to make something
• Focus on end product performance • Contain anything that cannot
• Include a feedback system on use and be defended with data
problems for future improvement
Notice IPC Standards and Publications are designed to serve the public interest through eliminating
misun