PCBA 半成品握持方法--------------------------------------------------------1-3
PCBA WIP Handing
SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度 (組件X方向)------------------1-4
SMD Assembly workmanship criteria--Chip component alignment( X Axis)
SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度 (組件Y方向)------------------1-5
SMD Assembly workmanship criteria--Chip component alignment( Y Axis)
SMT零件組裝工藝標準--圓筒形(Cylinder)零件之對準度------------------------1-6
SMD Assembly workmanship criteria--Cylinder component alignment
SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳面之對準度-----------------------1-7
SMD Assembly workmanship criteria--Gull-Wing footprint alignment
SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳趾之對準度-----------------------1-8
SMD Assembly workmanship criteria--Gull-Wing toe alingnment
SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳跟之對準度-----------------------1-9
SMD Assembly workmanship criteria--Gull-Wing heel alingnment
SMT零件組裝工藝標準--零件腳面(Latch of CN2302) 之對準度 -------------------1-10
SMD Assembly workmanship criteria-Component footprint (Latch of CN2302) alignment
SMT零件組裝工藝標準--J型腳零件對準度---------------------------------------1-11
SMD Assembly workmanship criteria--J type lead alignment
SMT焊點性工藝標準--鷗翼(Gull-Wing)腳面焊點最小量---------------------------1-12
SMD solder joint workmanship criteria--Minimum solder of Gull Wing footprint
SMT焊點性工藝標準--鷗翼(Gull-Wing)腳面焊點最大量---------------------------1-13
SMD solder joint workmanship criteria--Maximum solder of Gull Wing footprint
SMT焊點性工藝標準--鷗翼(Gull-Wing)腳跟焊點最大量---------------------------1-14
SMD solder joint workmanship criteria--Minimum solder of Gull Wing Heel
SMT焊點性工藝標準--J型接腳零件之焊點最小量---------------------------------1-15
SMD solder joint workmanship criteria--Minimum solder of J type lead
SMT焊點性工藝標準--J型接腳零件之焊點最大量工藝水準點-----------------------1-16
SMD solder joint workmanship criteria--Maximum solder of J type lead
SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點) --------------1-17
SMD solder joint workmanship criteria--Minimum solder fillet of chip component( 3 or 5 face terminations)
SMT焊點性工藝標準--晶片狀(Chip)零件之最大焊點(三面或五面焊點)--------------1-18
SM
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