PCB生产流程.xls

生产流程图剪料刷磨印线路烘烤蚀刻去墨中检钻固定孔印防焊/ 文字烘烤松香板中检冲成型V- CUT O/S 成检后处理机上松香 QA/ 包装电镀板前处理镀镍镀金中裁 LED 板冲成型 O/S 成检 QA/ 包装喷锡板喷锡前处理喷锡喷锡后处理冲成型成检 QA/ 包装▲ IPQC 站▲▲▲▲▲▲妥善活用资源秉持环保意识永不停歇追求品质于至善全方位满中客户要求 S/S 报废率: 小于等于 % S/S 退货率:小于等于 % D/S 报废率: 小于等于 % D/S 退货率:小于等于 % 样品达成率: 大于等于 95% 产前技术资料达成率:大于等于 95% 总厂双面镀金板制造流程(全面金板) D/S Gold - Plating Manufacturing Flow Chart (Panel Plating) 品管控制站 Quality Control Station 检修站 Inspection Station 制造站 Production Station Cutting Drilling Scrubbing Electroless Copper(PTH) Panel Plating Scrubbing S/C Image Transfer Touch - up Pattern Plating (B) Ni- Plating Gold - Plating ·V- Cut · NC Routing · Punching Stripping Etching Legend Printing O/S Testing &100% Final Insp. LPSM Packing 裁板(1) CNC 钻孔(2) IQC 刷磨(3) 化学铜(4) 一次铜(5) IPQC 刷磨(6) 影像转移(7) IPQC 检修 IPQC IPQC OQC QA IPQC IPQC 二次铜(8) 镀镍(9) 镀金去膜(墨)(10) 蚀刻(11) 短/断测试/检修湿膜防焊(12) 文字印刷(13) 成型(14) 短/断测试/检修包装 O/S Testing &100% Insp. ·V- Cut · NC Routing · Punching O/S Testing &100% Final Insp. Packing 总厂双面镀金板制造流程(全面金板) D/S Gold - Plating Manufacturing Flow Chart (Panel Plating) Ni- Plating Shipmen t 文字印刷(13) 出货 Shipmen t双面喷锡板制造流程 D/S . Manufacturing Flow Chart 品管控制站 Quality Control Station 检修站 Inspection Station 制造站 Production Station Cutting Drilling Scrubbing Electroless Copper(PTH) Panel Plating Scrubbing Pattern Plating (B) Tin Plating ·V- Cut · NC Routing · Punching Stripping Etching Legend Printing O/S Testing &100% Final Insp. LPSM Packing Shipment 裁板(1) CNC 钻孔(2) IQC 刷磨(3) 化学铜(4) 一次铜(5) IPQC 刷磨(6) S/C Image Transfer 影像转移(7) IPQC 检修 IPQC IPQC OQC QA IPQC IPQC 二次铜(8) 镀锡(9) 去膜(墨)(10) 蚀刻(11) 短/断测试/检修湿膜防焊(13) 文字印刷(14) 成型(16) 短/断测试/检修包装出 O/S Testing &100% Insp. Touch -up Solder Stripping 剥锡(12) Hot Air Leveling 喷锡(15) IPQC Packing ( A)Gold Finger Plating (to be continued next page) (A) 镀金手指(续下页) O/S Testing &100% Final Insp. Packing Shipment Packing 双面喷锡板制造流程 D/S . Manufacturing Flow Chart 文字印刷(14)