印制电路板加工中孔内与板面除胶差异研究.pdf

印制电路信息 2021 电镀涂覆 Plating Coating
印制电路板加工中孔内与板面除胶差异研究
韦进峰唐海波李恢海
523127
摘 要 SEM
关系和规律，通过表面除胶速率推算B
理，同时对除胶速率片的选择提出建议。
关键词 印制电路板加工；除胶；板面；孔内；等离子体
中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2021）05-0023-06

Study on the difference of desmear between inside hole and
surface in PCB processing
Wei Jinfeng Tang Haibo Li Huihai
Abstract The difference of desmear rate and SEM appearance between surface and hole is studied to find
out the relationship and law, by calculating the desmear condition of PCB based on surface desmear rate which is
more scientific and reasonable. Some suggestions are put forward for the selection of desmear rate testing sample.
Key words PCB Process; Desmear; On Surface; In Hole; Plasma; SEM
0 前言 事半功倍的效果。本文通过研究基材板面和孔内
除胶的差异和规律，对板材除胶条件的选择提供
随着印制电路板（PCB）应用频率提高，高
科学合理的参考依据。
频高速板材应用越来越广泛，对PCB孔金属化加
工要求也越来越高，尤其在除胶条件的选择上加