《电子封装互连方法》课件Chapter0 Introduction interconnection technology in electronic packaging.pptx
Interconnection Technology In Electronic Packaging September 15, Why? (Necessary--the purpose of the interconnection) What? (Definition--bonding interconnection) How? (Realization--methods used for the interconnection) Where? (Application---fields ) Contents Fundamentals of microjoining Solid state bonding mechanism Soldering and brazing mechanism Fusion microjoining Simulation Techniques for microjoining and nanojoining Wire bonding techniques in electronics Solid state diffusion bonding Soldering and brazing Laser and electron beam microwelding Resistance microwelding Nanojoining Materials cases and applications – Shape memory alloy, superconductor, SOFC, ceramics, plastics Applications of the interconnection tech. MICROSYSTEMS (Electronic Products, Photoelectrons, MEMS, etc.) Communications Consumer Electronics Space Applications Biomedical Applications Hand-held Devices Computers Manufacturing process of electronic products Silicon Wafer IC Assembly PCB Assembly System Assembly IC Packaging System Packaging Interconnection Interconnection tech. in electronic packaging Soldering Wire Bonding Applications of wire bonding Challenges: Multi types of materials-used, complicated structures, flexible manufacturing, long-term reliability ICs LED MEMS Sensors Structures of this course Bonding Interconnection Technologies Equipments Materials Quality & Reliability Characterization & Mechanism Application & Trending Fundamentals of Microjoining Objectives and description This course mainly introduces the research performances and new trend in the fields of microjoining and nanojoining these years, and the contents include the fundamental theories and practical applications of the microjoining. Three parts are: fundamentals, techniques of microjoining and the microjoing of m
《电子封装互连方法》课件Chapter0 Introduction interconnection technology in electronic packaging 来自淘豆网www.taodocs.com转载请标明出处.