先进的3d叠层芯片封装工艺及可靠性研究.pdf

学校代码 工
学 号
摄军大
硕 士 学 位 论 文
专业学位
先进 的 叠层芯片封装工艺及可靠性研究
系 信息科学与一…「程学院
业 电 子与通有丫工程
名 一「一二麦秀
指 甘 教 师 丁 」进 教授
完 成 日 期 年 月 日
目 录
摘 要 ··············, ·······························, ············、····························································……
··············································,····································································… …
引言 ················, ········, ·······························································································……
第 一章 绪 论 ···········································································································……
叠层 式 封装 的结构 与工艺 ·····························································……
圆 片减薄 技术 ·············································································· ···……
便 携 式 电子产 品 的叠层 封 装技 术符 合 的技术 要求 ···········……
叠层 式 封装 的性 能特 点和 技 术 优势 ············································……
裸 片堆 叠和封 装堆 叠 的性能特 点 ·································, ·······················……
叠层 式 封装 体 的散热 问题 ····························, ································……
叠 层 式 封 装 技术 的应用 前 景 ·······, ·, ··, ·, ·, ·········,······························……
第二章 叠层 芯 片封 装 工艺难 点及 解 决方 案 ···, ·········································……
超 薄 圆片减薄 、划片 ··································, ········································ ·……
崩 裂 成 因及对 策 ··························, ···················································· ……
薄裸芯片贴装 ·····························。················································ ……