PCB通孔电镀层剥离失效原因分析及改进.pdf

【电子技术/Electronic Technology】 DOI: -
PCB 通孔电镀层剥离失效原因分析及改进
陈正清 1, 2, *，宋祥群 1, 2，秦典成 1, 2，纪成光 1, 2，刘梦茹 1, 2
（，广东 东莞 523127；
，广东 东莞 523127）
摘要：针对高厚径比印制电路板(PCB)通孔的镀层剥离问题，先通过分析镀层剥离部位的微观形貌和元素组成推测相关因素，
再通过试验进行验证。结果发现，镀层剥离位于两次加厚铜镀层之间，主要是因为一次电镀层氧化，造成二次沉铜过程中微蚀
效果不佳，引起镀层间结合力下降。改用连续两次沉铜后再连续两次电镀的工艺后，上述问题得以解决。
关键词：印制电路板；通孔；沉铜；电镀；剥离；氧化
中图分类号： 文献标志码：A 文章编号：1004 – 227X (2021) 11 – 0838 – 05
Reason analysis on delamination between electroplated copper coatings of through holes
and corresponding improvement measures
CHEN Zhengqing 1, 2, *, SONG Xiangqun 1, 2, QIN Diancheng 1, 2, JI Chengguang 1, 2, LIU Mengru 1, 2
(1. Shengyi Electronics Co., Ltd., Dongguan 523127, China;
2. Guangdong High-class Communication PCB Engineering Technology Research and Development Center, Dongguan 523127, China)
Abstract: As for the delamination problem between copper coatings of through holes with a high aspect ratio on printed
circuit board (PCB), the corresponding factors were speculated by analyzing the micromorphology and elemental
composition of delaminated part