工艺条件对线路板化学镀钯的影响.pdf

Dec. 2020 Plating and Finishing Vol. 42 No. 12 Serial No. 333
·20·
doi gold
Abstract： ，
plating on the nickel layer. Our company developed a process for electroless nickel palladium plating on
circuit boards. The effects of electroless palladium plating temperature and pH on the deposition rate
，
palladium plating layer morphology and nickel layer corrosion during gold plating were studied. The re-
sults show that the deposition rate of electroless palladium plating in the temperature range of 45~60 ℃
increases nearly linearly with temperature. The deposition rate of palladium plating in the pH range of
and also increase slowly with the increase of pH value. When the temperature is 50 ℃ and the pH
value is the deposition rate of electroless palladium plating is stable and the crystallization of the
， ，
coating is fine which can effectively reduce the nickel corrosion during gold plating. The average break-
，
ing force of the nickel palladium coating is g. The fracture mode is determined to be mode A 3 solder
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joint fractu