SMT 整个工艺流程细讲一、 SMT 工艺流程简介........................................................................................................... 4 二、焊接材料............................................................................................................................. 6 锡膏............................................................................................................................................. 6 锡膏检验项目..................................................................................................................... 9 锡膏保存,使用及环境要求............................................................................................ 9 助焊剂( FLUX ) ...................................................................................................................... 9 焊锡: ....................................................................................................................................... 11 红胶........................................................................................................................................... 11 洗板水....................................................................................................................................... 12 三、钢网印刷制程规范........................................................................................................... 13 锡膏印刷机(丝印机) ........................................................................................................... 13 SMT 半自动印刷机(PT-250) 作业规范........................................................................... 13 刮刀(squeegee) ................................................................................................................. 14 真空支座........................................................................................................................... 14 影响因素................................................................................................................................... 15 1 .钢网/PCB 精确对位: ............................
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