arlon材料.pdf

65GT, 55ST, 55NT and 55RT
Arlon Epoxy Nonwoven
Aramid Products
Electronic Substrates
A MATERIALS FOR ELECTRONICSWhy Use Arlon’s Epoxy Nonwoven Aramid Products?
When HDI Requirements Necessitate Surface Microvias
• Convenient Cost Effective Laser Microvia Formation
• Random Fiber Reinforcement Resists Resin Cracking
• Controlled Flow of Resin for Parallel Planar Surfaces
Arlon's epoxy NWA products allow the formation of
cleaner (vs. FR-4) laser microvias in surface layers while
permitting the use of buried FR-4 signal bus layers in the
center. In many cases this results in greatly improved
interconnect density at reduced total cost, a key objective
in many applications, and particularly in mobile electronic
devices.
When Performance Criteria Demand CAF Resistance
• When Hole Spacing is Sized for sub mm Pitch
• Random Fiber Aramid Reduces the Available Path for CAF
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CAF (Conductive Anodic Filament) formation requir