常用计算机词汇.doc

常用计算机词汇
1、CPU
3DNow!(3D no waiting)
ALU(Arithmetic Logic Unit,算术逻辑单元)
AGU(Address Generation Units,地址产成单元)
BGA(Ball Grid Array,球状矩阵排列)
BHT(branch prediction table,分支预测表)
BPU(Branch Processing Unit,分支处理单元)
Brach Pediction(分支预测)
CMOS: (Complementary Metal Oxide
Semiconductor,互补金属氧化物半导体)
plex Instruction puting,复杂指令集计算机)
CLK(Clock Cycle,时钟周期)
COB(Cache on board,板上集成缓存)
COD(Cache on Die,芯片内集成缓存)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPU(Center Processing Unit,中央处理器)
Data Forwarding(数据前送)
Decode(指令解码)
DIB(Dual Independent Bus,双独立总线)
EC(Embedded Controller,嵌入式控制器)
Embedded Chips(嵌入式)
EPIC(explicitly parallel instruction code,并行指令代码)
FADD(Floationg Point Addition,浮点加)
FCPGA(Flip Chip Pin Grid Array,反转芯片针脚栅格阵列)
FDIV(Floationg Point Divide,浮点除)
FEMMS:(Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态)
FFT(fast Fourier transform,快速热欧姆转换)
FID(FID:Frequency identify,频率鉴别号码)
FIFO(First Input First Output,先入先出队列)
flip-chip(芯片反转)
FLOP(Floating Point Operations Per Second,浮点操作/秒)
FMUL(Floationg Point Multiplication,浮点乘)
FPU(Float Point Unit,浮点运算单元)
FSUB(Floationg Point Subtraction,浮点减)
GVPP(Generic Visual Perception Processor,常规视觉处理器)
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状矩阵封装
IA(Intel Architecture,英特尔架构)
ICU(Instruction Control Unit,指令控制单元)
ID:(identify,鉴别号码)
IDF(Intel Developer Forum,英特尔开发者论坛)
IEU(Integer Execution Units,整数执行单元)
IMM:( Intel Mobile Module, 英特尔移动模块)
Instructions Cache,指令缓存
Instruction Coloring(指令分类)
IPC(Instructions Per Clock Cycle,指令/时钟周期)
ISA(instruction set architecture,指令集架构)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(Lightning Data Transport,闪电数据传输总线)
Local Interconnect(局域互连)
MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)
MMX(MultiMedia Extensions,多媒体扩展指令集)
MMU(Multimedia Unit,多媒体单元)
MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)
MHz(Million Hertz,兆赫兹)
MP(Multi-Processing,多重处理器架构)
MPS(MultiProcessor Specification,多重处理器规范)
MSRs(Mode