半导体制造专业英语术语(1).doc

A1stlevelpackaging第一级封装2ndlevelpackaging第二级封装aberration象差/,,轮流的,,轮流,改变aluminum铝aluminumsubtractiveprocess铝刻蚀工艺ambient环境ammonia(NH3)氨气ammoniumfluoride(NH4F)***化氨ammoniumhydroxide(NH4OH)氢氧化氨amorphous非晶的,无定型analog模拟信号angstrom埃anion阴离子anisotropicetchprofile各向异性刻蚀剖面anneal退火antimony(sb)锑antirelectivecoating(ARC)抗反射涂层APCVD常压化学气向淀积applicationspecificIC(ASIC)专用集成电路aqueoussolution水溶液areaarray面阵列argon(Ar)n.[化]氩arsenic(As)***arsine(AsH3)***化氢,***烷ashing灰化,去胶aspectratio深宽比,高宽比aspectratiodependentetching(ARDE)(APCVD)常压化学气向淀积atomicforcemicroscopy(AFM),尝试,,企图augerelectronspectroscopy(AES)俄歇电子能谱仪autodoping自掺杂automaticdefectclassification(ADC)缺陷自动分类Bback-endofline(BEOL)(生产线),阻碍,为难(挡片),装配,集会,集结,汇编(挡片块)ballgridarray(BGA)球栅阵列ballroomlayout舞厅式布局,超净间的布局barrelreactor圆桶型反应室barriermetal阻挡层金属barriervoltage势垒电压base基极,基区batch批bayandchaselayout生产区和技术夹层区beamblow-up离子束膨胀beamcurrent束流beamdeceleration束流减速beamenergy离子束能量beol(生产线)后端工序bestfocus最佳聚焦BGA球栅阵列Biasing电压拉偏BICMOS双极CMOSbincodenumber分类代码号binmap分类图bipolarjunctiontransistor(BJT)双极晶体管bipolartechnology双极技术(工艺)bird’sbeakeffect鸟嘴效应blanketdeposition均厚淀积blower增压泵boat舟BOE氧化层刻蚀缓冲剂Bonvoyage[法]再见,一路顺风[平安]bondingpads压点bondingwire焊线,引线boron(B)硼borontrichloride(BCL3)三***化硼borontrifluoride(BF3)三***化硼borophosphosilicateglass(BPSG)硼磷硅玻璃borosilicateglass(BSG)硼硅玻璃bottomantireflectivecoating(BARC),括弧,,起始的干法刻蚀步骤brightfielddetection亮场检查brushscrubbing涮洗bubbler带鼓泡槽bufferedoxideetch(BOE)氧化层腐蚀缓冲液bulkchemicaldistribution批量化学材料配送bulkgases大批气体bulkheadequipmentlayout穿壁式设备布局bumpedchip凸点式芯片buriedlayer埋层burn-box燃烧室(或盒)burn-A化学放大(胶)cantilevern.[建]悬臂cantileverpaddle悬臂桨capoxide掩蔽氧化层capacitance电容capacitance-voltagetest(C-Vtest)电容-电压测试capacitiv