PCB中英文对照.doc

PCB线路板工艺流程及中英文对照(2009/04/08 13:56)
目录: 公司动态
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流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油)
--镀金--喷锡--成型--开短路测试--终检--雷射钻孔
A. 开料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料发料(Panel)(Shear material to Size)
B. 钻孔(Drilling)
b-1 内钻(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射钻孔(Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)
C. 干膜制程( Photo Process(D/F))
c-1 前处理(Pretreatment)
c-2 压膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 显影(Developing)
c-5 蚀铜(Etching)
c-6 去膜(Stripping)
c-7 初检( Touch-up)
c-8 化学前处理,化学研磨( Chemical Milling )
c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)
c-10 显影(Developing )
c-11 去膜(Stripping )
Developing , Etching & Stripping ( DES )
D. 压合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蚀(Microetching)
d-3 铆钉组合(eyelet )
d-4 叠板(Lay up)
d-5 压合(Lamination)
d-6 后处理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
E. 减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F. 电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)
f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅( Tin-Lead Stripping)
f-7 微切片( Microsection)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(绿漆/绿油): (Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)
h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 喷砂( Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask)
I . 镀金Gold plating
i-1 金手指镀镍金( Gold Finger )
i-2 电镀软金(Soft Ni/Au Plating)
i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
J. 喷锡(Hot Air Solder Leveling)
j-1 水平喷锡(H