面向三维堆叠封装的芯片间电感耦合无线收发电路的设计与研究.pdf

华中科技大学
硕士学位论文
面向三维堆叠封装的芯片间电感耦合无线收发电路的设计与研
究
姓名:王建
申请学位级别:硕士
专业:集成电路工程
指导教师:邹雪城
2011-05-27
华中科技大学硕士学位论文
摘要
三维芯片堆叠封装是一种具有众多优势的系统集成方式,而芯片互联技术是实现
三维堆叠系统的关键技术。本文研究用于三维堆叠封装的高性能电感耦合无线互联
技术,研究并设计了一款寄生效应小、通讯质量高、成本低廉、高性能的电感耦合
无线互联收发器模块。
本文首先介绍了电感耦合无线互联基本通讯原理,并着重分析了多芯片间如何进
行正常的数据通讯和传输,以及收发器模块的工作原理和数字控制芯片的控制原理;
然后重点叙述了收发器结构、多层金属螺旋电感、Single-Ended 发射器和反向不归零
信号处理收发器的设计。为了方便测试,在发射器中采用了电流控制器,并且在接
收器中加入了信号放大器以及整理电路来提高信号的接收能力和降低信号的失真;
最后完成了电路的具体参数设计,并进行了仿真分析。
本文的设计在 Linux 平台和 cadence 环境下,采用 工艺,
对电感耦合无线互联的收发器模块进行设计与仿真。结果显示,本文设计的这种多
芯片间电感耦合无线互联收发器模块,发送的测试信号与接收到的信号基本完全一
致,无明显失真现象。这表明本文设计的这种电感耦合无线互联的收发器模块通讯
的质量高、寄生效应小,达到了较高的水平。

关键词: 电感耦合三维堆叠封装无线互联收发器金属螺旋电感







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华中科技大学硕士学位论文
Abstract
Three-dimensional stacked encapsulating of chips is a kind of method of system
integration which possesses many advantages, and chips-superconnect technique is the
key to achieve three-dimensional stack. The high-performance inductive coupling wireless
connection technique used to three-dimensional stacked encapsulating studies and designs
the transceiver module of inductive coupling wireless connection. The transceiver module
is possessed of little parasitic effect, high-munication, low cost and high
performance.
At first, the munication theory of inductive coupling wireless connection is
introduced and the formal munication and transmission among several chips
is analyzed. In the following, the working principle of transceiver module and the
controlling principle of number controlling chips are presented. And then the design of
transceiver module, multilevel metallic spiral inductor, Single-Ended emitter and
nonreturn-to-zero processing transceiver are stated in the article. For help to test, the
current controller is adopted in emitter and signal amplifier and sorted circuit are added in
transceiver to enhance the received capability and reduce the deformation of signals. In
the end, the propo