2020年J-STD-020D(中英文对照版)资料.doc

J-STD-020DMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices非密封固态表面贴装元件湿度/回流焊敏感度分级1PURPOSE(目的)Thepurposeofthisstandardistoidentifytheclassificationlevelofnonhermeticsolidstatesurfacemountdevices(SMDs)thataresensitivetomoisture-inducedstresssothattheycanbeproperlypackaged,stored,andhandledtoavoiddamageduringassemblysolderreflowattachmentand/,储存,-termreliability本标准用于判定合格的SMT封装应使用何种等级/Scope(范围)ThisclassificationprocedureappliestoallnonhermeticsolidstateSurfaceMountDevices(SMDs)inpackages,which,becauseofabsorbedmoisture,-(boardassemblyoperations)ofthelevelofmoisturesensitivityoftheirproductdevices,andbyboardassemblyoperationstoensurethatproperhandlingprecautionsareappliedtomoisture/,,“SMD”(PCBA组装)其产品的湿敏等级,确保元件使用者能恰当作业,如果对之前认证过的SMD封装没有重大更改,.ponent,,,thedevelopmentshouldincludecustomer/,,,-STD-020,JESD22-A112(rescinded),orIPC-SM-786(rescinded)-STD-020,JESD22-A112(已作废),IP