外文翻译(中英文翻译,文献翻译,英文翻译).doc

外文翻译
英文原文:
High-speed grinding ---applicationsand future technology
Abstract
The basic mechanisms and the applicatlysesthe cutting mechanism in grinding. The mean unreformedchip thickness, hcu, and the mean chip length, lcu, areemployed as variables to describe the shape of the chip. Theunreformed chip thickness is dependent on the static densityof cutting edges, Cstat, and on the geometric and kinematicsvariables [1,2]:
(1)
where Vw is the work piece speed, VS the grinding wheelspeed, ae the depth of cut, deq the equivalent grinding wheeldiameter, and α，β，γare greater than zero. On the basis ofthis relationship, it can be established that an increase in thecutting speed, assuming all other conditions are constant,will result in a reduction in the unreformed chip work piece material is machined with a larger number ofabrasive grain contacts. At the same time, the number ofcutting edges involved in the process decreases. This leads tothe advantages promised by high-speed grinding which ischaracterized by a reduction in grinding forces, grindingwheel wear, and in work piece surface roughness. Consequently,increasing the speed of the grinding wheel can leadto an increase in the quality of the work piece material, oralternatively, an increase in productivity. The process technologydepends on the characteristics and quality requirements
of the work piece to be machined.
As the cutting speed increases, the quantity of thermalenergy that is introduced into the work piece also increase in cutting speed is not normally accompanied bya proportional reduction in the tangential grinding force, andthus results in an increase in process power. Reducing thelength of time the abrasive grain is in contact with thework piece can reduce the quantity of heat into the work increase in the machining rate of the process isnecessary for this to happen, where the chip thickness isincreased to the level that applies to lower cutting speedswitho