IPC 7530 Guidelines for temperature Profiling for Mass Soldering (Reflow & Wave).pdf

ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES ®
IPC-7530
Guidelines for Temperature
Profiling for Mass Soldering
Processes (Reflow & Wave)
IPC-7530
May 2001 A guide developed by IPC
2215 Sanders Road, Northbrook, IL 60062-6135
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The Principles of In May 1995 the IPC’s Technical Activities mittee adopted Principles of
Standardization Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should: Standards Should Not:
• Show relationship to Design for Manufacturability • Inhibit innovation
(DFM) and Design for the Environment (DFE) • Increase time-to-market
• Minimize time to market • Keep people out
• Contain simple (simplified) language • Increase cycle time
• Just include spec information • Tell you how to make something
• Focus on end product performance • Contain anything that cannot
• Include a feedback system on use and be defended with data
problems for future improvement
Notice IPC Standards and Publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for his particular need. Existence of such Standards and Publications
shall not in any respect preclude any member or nonmember of IPC from manufacturing or sell-
ing products not conforming to such Standards and Publication, nor shall the existence of such
Standards and Publications preclude their voluntary use by those other than IPC members,
whether the standard is to be used either domestically or internationally.
mended Standards and Publications are adopted by IPC without regard to whether their
adoption may involve patents on articles, materials, or processes. By such action, IPC does
not assume any liability to any patent owner, nor do they assume any obligation wh