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热处理工艺对Cu—Cr—Zr合金组织及性能的影响
程智刚,王自东,林国标,张鸿,赵美,张茂奎
(北京科技大学材料科学与工程学院,北京]00083)
摘要:为了研究固溶时效处理工艺对Cu—,在固溶温度920~1000℃和固
~,时效温度450~500℃和时效时间13-20h条件下,通过扫描电镜观察固溶时效后合金的微观组织和析出
相的形态,并测得相应条件下的导电率数值确定了较好的固溶时效工艺,在980℃固溶2h,450℃时效20 h,合金抗
拉强度可以达到440MPa,导电率可以达到80%IACS。
关键词:;固溶;时效;抗拉强度;导电率
中图分类号:TG146.¨ 文献标识码:A 文章编号:100l一4977(2008)02—0122—04
InfluenceofHeat Treatment on Microstructureand Properties of
Cu--Cr--ZrAlloy
CHENG Zhi-gang,WANG Zi-dong,LIN Guo-biao,ZHANG Hong,ZHAOMei,ZHANG Mao-kui
(School of Materials Science and Engineering,University of Science and Technology Beijing, andTechnologyScience Beijing, andof Engineering,UniversityScience Materials of (School
Beijing 1 00083,China) 1 Beijing
Abstract: The effects of solid solution and aging parameters on micrOstructure and electrical
conductivity properties of - alloy have been m icrostructure iS
observed by means ofSEM underthe condition ofsolid solution temperature 920-1000 ℃.solution
time h,aging temperature450-500 ℃ and aging time3-20 1 h,and the electricalconductivity
areavailable according todifferent parameters ofsolid solution and aging have been
confirmed,and the results showed that the tensile strength and electrical conductivity of the alloy
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