solder ball 锡球的简介和制作工艺.pptx

SHANGHAI HIKING SOLDER MATERIAL TECHNOLOGY CO., LTD
DAVID LIU
**********
exporter@
hiking group  shanghai hiking solder material technology co.,ltd.
Shanghai Hiking Solder Material Technology Co., Ltd. is a subsidiary of Hiking Group(a public pany at Shanghai Stock Exchange and stock code: 600735). The main products include various of BGA, CSP encapsulating lead and lead-free tin products such as solder ball, solder paste, solder wire, solder bar and flux etc. We are the pany of solder material. We have established a cooperative relationship with many large panies, such as ASESH, QUANTA, AMKOR, LOTES, ATECH, SPIL, MOLEX, ECS, UTAC, JCAP, and SPREADTRUM etc. We have a number of patents and adopted the following certification: IS09001、ISO14001、QC080000 and TS16949.
Factory Add:Lane 2328 Chunshen Road, Shanghai, China.
Pates of certificate
PATENT
PATENT
QC080000
ISO14001
TS16949
ISO9001
BGA Solder Ball- Description
Diameter Ø (mm)
Standard
Controlled
Tolerance (mm)
Roundness
Tolerance (mm)
Roundness
Ø≧
±
<%
±
<%
≦Ø <
±
±
≦Ø <
±
±
Ø <
±
±
Cpk
>
NA
>
NA
Diameter=
Roundness=
Y
X
We have two crafts: jetting and cutting production, so we can satisfy many kinds of needs position and quality of packing enterprise.
BGA Solder Ball- Process
Two
Crafts
Cutting
Jetting
Alloy
Spray
Wire solder
Cutting
Oil melting
Cleaning
Roundness screening
Diameter screening
Inspection
Delivery
Inspection
Packing
Qualified ball
Qualified ball
BGA solder ball
540000 KK
Flux
600 tons
1200 tons
1500 tons
Tin ball
1000 tons
600 tons
BGA solder ball:540000KK, Others:4900 tons
TOTAL
Annual output
Solder paste
Wire solder
Bar solder
Main customers
ASE Assembly & Test(Shanghai) Limited
Siliconware Precision Industries Co., Ltd
AMKOR ASSEMBLY AND TEST (SHANGHAI) CO, LTD.
EXPRESS ELECTRONICS(SUZHOU)CO., LTD.
TECH-FRONT(PUTER CO.,LTD.