JSTDD中英文对照版.docx

Document serial number【LGGKGB-LGG98YT-LGGT8CB-LGUT-LGG08】
JSTDD中英文对照版
J-STD-020D
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
非密封固态表面贴装元件湿度/回流焊敏感度分级
1 PURPOSE(目的）
The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装，储存，作业以避免在回流和维修作业中被损伤.
This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability
本标准用于判定合格的SMT封装应使用何种等级/
Scope（范围）
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to .
此分类程序适用于所有非密封固体表面贴装元件，此部分元件由于吸收湿气而在回流焊接中容易损伤. 本文件所提及的术语“SMD”（PCBA组装）其产品的湿敏等级，确保元件使用者能恰当作业，如果对之前认证过的SMD封装没有重大更改，依据此方法亦可用于元件的再次分类.
This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide