hdi板制作过程盲孔内铜层结合力管控与监测方法探讨.doc

------------------------------------------------------------------------------------------------ —————————————————————————————————————— HDI 板制作过程盲孔内铜层结合力管控与监测方法探讨发布者: 深圳贝加电子材料有限公司发布时间: 2015-04-22 阅读: 140 次 Study on blind-hole copper layer binding force control and monitoring method in HDI board production process 作者:刘建军/LIU Jian-jun 陈山东/CHEN Shan-dong 刘宗德/LIU Zong-de 特别感谢:陈兴农、梁志立摘要: HDI 板中,微埋/ 盲孔内的金属化镀铜层与内层线路铜层的连接可靠性是影响产品质量的关键因素, 并且直接决定了使用 HD I 电路板的电子产品的整机质量和寿命。影响铜层结合可靠性的因素众多, HDI 制造过程中的沉铜、电镀工艺是其中的主要影响因素。本文通过对沉铜、电镀过程的工艺控制、监控和检测方法进行研究, 提供了一种保证微导通孔可靠连接的方法。 Abstract : For HDI board, the connection reliability between micro buried/blind hole ’s metaliz ed copper plated layer and inner copper layer is the key factor to affect the quality of products, which also directly determines the quality and service life of entire machine who is assembled with HDI board. There are many factors which can affect the copper layer connection reliability, while the electroless plating copper and electroplating processes are the major influence factors. Through ------------------------------------------------------------------------------------------------ —————————————————————————————————————— study on the technologies and detection method of electroless plating copper and electroplating processes, this paper strives to provide a way for making sure the reliable connection of micro via hole. 关键词: HD