LCM模组工艺流程[1]1.ppt

LCM 工艺制程介绍浙江凯信光电科技有限公司 编写人:金术伦 Evaluation only. Evaluation only. Created with Client Profile . Created with Client Profile . Copyright 2004-2011 Aspose Pty Ltd. Copyright 2004-2011 Aspose Pty Ltd. LCM 基本結構讯号处理(电气回路)讯号 B/L 电源回路 Driver IC Data Driver IC Scan Panel LCD 模组的基本架构模组架构讯号界面 OLB / COG Bonding Solder/ACF Bonding Bezel 组立 B/L 组立 LCD 模组制程是将 LCD 的各部品依其功能将其统合在设计好的模组架构中且使该模组能达到所需要的品质要求 Evaluation only. Evaluation only. Created with Client Profile . Created with Client Profile . Copyright 2004-2011 Aspose Pty Ltd. Copyright 2004-2011 Aspose Pty Ltd. 焊接 Soldering 贴胶带 Tape Attaching 部件组裝 Parts Assembly COG 现行模组工艺流程功能测试 Function Test OLB 清洁 LCD OLB Cleaning 最终测试 Final Test 外观检验 Appearance Inspection 包裝 Packing 入库 Warehouse 来料检验 Materials Inspection LCD 清洁 LCD ILB Cleaning LCD 上料 LCD Loading ILB ACF 贴付 ILB ACF Attaching Chip 预压 Chip Pre-bonding Chip 本压 Chip Main-bonding LCD 下料 LCD Unloading OLB ACF 贴付 OLB ACF ttaching 对位本压 FPC Bonding 封 Silicon 胶 Coating Silicon 贴偏光片 Polarizer Attaching Evaluation only. Evaluation only. Created with Client Profile . Created with Client Profile . Copyright 2004-2011 Aspose Pty Ltd. Copyright 2004-2011 Aspose Pty Ltd. 来料检验与清洁 Materials Inspection & Cleaning 用无尘纸或无尘布醮异丙醇或酒精将 LCD ITO 端子上的异物驱除管制点:使用溶剂擦拭方法 Evaluation only. Evaluation only. Created with Client Profile . Created with Client Profile . Copyright 2004-2011 Aspose Pty Ltd. Copyright 2004-2011 Aspose Pty Ltd. COG 邦定 COG bonding COG 是Chip OnGlass 之简称,是指将驱动 LCD 之 Driver IC 压合在 LCD 上之技术。管制点:温度时间压力 Evaluation only. Evaluation only. Created with Client Profile . Created with Client Profile . Copyright 2004-2011 Aspose Pty Ltd. Copyr